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B92 Datasheet(PDF) 3 Page - Apacer Technology Inc.

Part # B92
Description  PCI Express Flash Drive PV910-M280 Product Specifications
PDF  24 Pages
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Manufacturer  APACER [Apacer Technology Inc.]
Direct Link  https://www.apacer.com/
Logo APACER - Apacer Technology Inc.

B92 Datasheet(HTML) 3 Page - Apacer Technology Inc.

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© 2021 Apacer Technology Inc.
Table of Contents
1. General Descriptions ........................................................................4
2. Functional Block ...............................................................................4
3. Pin Assignments................................................................................5
4. Product Specifications......................................................................7
4.1 Capacity......................................................................................................................................... 7
4.2 Performance .................................................................................................................................. 7
4.3 Environmental Specifications ........................................................................................................ 7
4.4 Mean Time Between Failures (MTBF) .......................................................................................... 8
4.5 Certification and Compliance......................................................................................................... 8
4.6 Endurance ..................................................................................................................................... 8
4.7 LED Indicator Behavior.................................................................................................................. 9
5. Flash Management ..........................................................................10
5.1 Error Correction/Detection........................................................................................................... 10
5.2 Bad Block Management .............................................................................................................. 10
5.3 Global Wear Leveling .................................................................................................................. 10
5.4 Flash Translation Layer
– Page Mapping....................................................................................10
5.5 Power Failure Management ........................................................................................................ 11
5.6 TRIM ............................................................................................................................................ 11
5.7 Over-Provisioning ........................................................................................................................ 11
5.8 Hyper Cache Technology ............................................................................................................ 11
5.9 SMART Read RefreshTM ............................................................................................................. 11
5.10 NVMe Secure Erase.................................................................................................................. 11
6. NVMe Support Features..................................................................12
6.1 Host Memory Buffer..................................................................................................................... 12
7. Security & Reliability Features ......................................................13
7.1 Thermal Sensor ........................................................................................................................... 13
7.2 Thermal Throttling ....................................................................................................................... 13
7.3 Advanced Encryption Standard ................................................................................................... 13
7.4 End-to-End Data Protection......................................................................................................... 13
7.5 Signed Firmware ......................................................................................................................... 13



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