2001 Dec 04

7

Philips Semiconductors

Preliminary specification

dual band UHF amplifier module for

GSM900 and GSM1800

BGY282

APPLICATION INFORMATION

RF output 2

DCS in

DCS out

+V

S

7

8

9

10

11

6

12

GND

GND

GND

4

RF in

V

C

+V

S

1

GND

2

3

5

RF output 2

RF output 1

RF output 1

PAM1

Fig.6 Test circuit.

List of components

Note

1.

The striplines are on a double etched printed circuit board (

ε

QUANTITY

LOCATION

VALUE / TYPE

DESCRIPTION

REMARK

SUPPLIER

1

PCB

Roland

Haefele

1

PAM1

BGY282

Power amplifier module

4

Jack assembly end launch

SMA connector

Type no. 142-0701-881

Johnson

Components

1

C1

100

µF / 35 V

Electrol. capacitor

Type no. ECEV1VA101P

Matsushita

1

C2

100

µF / 35 V

Electrol. capacitor

Type no. ECEV1VA101P

Matsushita

1

C3

100 nF

0805 size SMD capacitor

1

C4

100 nF

0805 size SMD capacitor

1

C7

680 pF

0603 size SMD capacitor

1

C8

100 pF

0603 size SMD capacitor

1

R1

100 Ohms / 0.1

W

0805 size SMD resistor

4Z0

50

Ω

stripline; note 1

width 1.4 mm