2001 Dec 04

8

Philips Semiconductors

Preliminary specification

dual band UHF amplifier module for

GSM900 and GSM1800

BGY282

TOP VIEW

Fig.7 PCB test circuit.

SOLDERING

The indicated temperatures are those at the solder

interfaces.

Advised solder types are types with a liquidus less or

equal to 210

°C.

Soldering can be carried out using a conveyor oven, a hot

air oven, an infrared oven or a combination of these

ovens. A double reflow process can be used.

Hand soldering is not recommended because of the

nature of the contacts.

The maximum allowed temperature is 250

°C for a

maximum of 5 seconds.

The maximum ramp-up is 10

°C per second.

The maximum cool-down is 5

°C per second.

Fig.8 Recommended reflow temperature profile.

handbook, halfpage

0

300

200

100

0

15

23

4

MGM159

t (min)

T

(

°C)