2001 Dec 04

10

Philips Semiconductors

Preliminary specification

dual band UHF amplifier module for GSM900 and GSM1800

BGY282

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

01-09-26

01-11-20

IEC

JEDEC

EIAJ

SOT632A

0

5

10 mm

scale

Leadless surface mounted package; plastic cap; 12 terminations

SOT632A

A

c

E1

D

5

12

4

3

7

6

12

11

10

8

9

D1

E

(4

×)

(4

×)

pin 1 index

UNIT

mm

1.5

1.4

3.75

3.65

1.8

1.4

2.1

4.0

bb1

DIMENSIONS (mm are the original dimensions)

A

14.05

13.45

D

0.61

0.49

c

13.35

13.05

D1

8.3

7.7

Ee

3.275

e1

7.85

7.55

1.45

1.35

E1

e2

L

3.75

3.65

Z

2.45

2.35

Z1

1.55

1.45

ZD

1.55

1.45

Z2

1.35

1.25

Z3

0.75

0.65

Z4

0.7

0.6

Z5

0.625

0.525

Z6

1.55

1.45

Z7

0.75

0.65

Z8

0.85

0.75

Z9

b1 (4×)

L

(12

×)

ZD (2×)

Dimensions of solderresist

Dimensions of terminations

Z7

(4

×)

e

b (8

×)

(2

×)

e1

Z3

(2

×)

Z5 (4×)

Z2

(6

×)

e2

Z4

(8

×)

Z8

Z9

Z (2

×)

Z6 (4×)

Z1

(4

×)