August 1986

8

Philips Semiconductors

Product specification

UHF linear power transistor

BLW32

L1; L2; L3; L6 and L7 are striplines on a double Cu-clad printed-circuit board with PTFE fibre-glass dielectric (

thickness 1/16".

Component layout and printed-circuit board for 860 MHz test circuit are shown in Fig.9. For bias circuit see Fig.10.

The circuit and the components are situated on one side of the PTFE fibre-glass board, the other side being fully

metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the emitter leads Cu

straps are used for a direct contact between upper and lower sheets.

Fig.9 Component layout and printed-circuit board for 860 MHz test circuit.

handbook, full pagewidth

MGP436

L1

L4

L2

L3

L5

L7

L6

C1

C2

C3

C11

C13

C15

+

C10

C9

C4

C5

C6

C14

C12

C8

C7

+VBB

+VCC

114.5

46