MP9459 – SYNCHRONOUS, STEP-DOWN CONVERTER W/ INTERNAL MOSFETS

MP9459 Rev. 1.0

www.MonolithicPower.com

3

1/13/2020

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ABSOLUTE MAXIMUM RATINGS (1)

VIN................................................ -0.3V to +18V

VSW ................................ -0.6V (-6.5V for <10ns)

to VIN + 0.3V (19V for <10ns)

VBST .....................................................VSW + 5V

VEN ............................................ -0.3V to +5V (2)

All other pins.................................. -0.3V to +5V

Continuous power dissipation (TA = 25°C)

(3) (5)

..................................................................2.2W

Junction temperature ............................... 150°C

Lead temperature .................................... 260°C

Storage temperature................ -65°C to +150°C

ESD Rating

Human-body model (HBM) ......................2000V

Charged-device model (CDM)..................1500V

Recommended Operating Conditions (4)

Supply voltage (VIN) ........................ 4.2V to 17V

Output voltage (VOUT)............. 0.8V to VIN x DMAX

or 10V max

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance

SOT563

θJA

θJC

EV9459-TF-00A (5) ................ 55......21..... °C/W

JESD51-7 (6) ......................... 130...... 60 ... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) For details on

EN’s ABS max rating, see the Enable (EN)

Control section on page 10.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on EV9459-TF-00A, 2-layer PCB.

6) The value of

θ

JA given in this table is only valid for comparison

with other packages, and cannot be used for design

purposes. These values were calculated in accordance with

JESD51-7, and simulated on a specified JEDEC board. They

do not represent the performance obtained in an actual

application.