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RT7207 Datasheet(PDF) 24 Page - Richtek Technology Corporation

Part # RT7207
Description  USB PD Type-C Controller for SMPS
PDF  25 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT7207 Datasheet(HTML) 24 Page - Richtek Technology Corporation

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RT7207
24
DS7207-00 January 2017
www.richtek.com
©
Copyright
2017 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Figure 12. OVP Pin Block Diagram
Figure 13. Timing Sequence of the OVP Pin Function
Thermal Considerations
The junction temperature should never exceed the
absolute maximum junction temperature TJ(MAX), listed
under Absolute Maximum Ratings, to avoid permanent
damage to the device. The maximum allowable power
dissipation depends on the thermal resistance of the IC
package, the PCB layout, the rate of surrounding airflow,
and the difference between the junction and ambient
temperatures. The maximum power dissipation can be
calculated using the following formula :
PD(MAX) = (TJ(MAX)
− TA) / θJA
where TJ(MAX) is the maximum junction temperature, TAis
the ambient temperature, and
θJA is the junction-to-ambient
thermal resistance.
For continuous operation, the maximum operating junction
temperature indicated under Recommended Operating
Conditions is 125
°C. The junction-to-ambient thermal
resistance,
θJA, is highly package dependent. For a
WQFN-24L 4x4 package, the thermal resistance,
θJA, is
28
°C/W on a standard JEDEC 51-7 high effective-thermal-
conductivity four-layer test board. The maximum power
dissipation at TA = 25
°C can be calculated as below :
PD(MAX) = (125
°C − 25°C) / (28°C/W) = 3.57W for a
WQFN-24L 4x4 package.
The maximum power dissipation depends on the operating
ambient temperature for the fixed TJ(MAX) and the thermal
resistance,
θJA. The derating curves in Figure 14 allows
the designer to see the effect of rising ambient temperature
on the maximum power dissipation.
Figure 14. Derating Curve of Maximum Power Dissipation
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
25
50
75
100
125
Ambient Temperature (°C)
Four-Layer PCB
VREF_CV
OPTO
R1
BLD_EN
RD
+
-
x1.2/x1.25/x1.3
+
-
VFB
RFB1
RFB2
RV
CV
VDD
RD2
R
S
Q
VVDD_OFF
ADC
MCU
INT_
“VDDOV”
VOUT
A
OVP
VOUT
INT_VDDOV
VOVP
OV hys
tD_VOUTOVP
VDD = VVDD_OFF
Debounce time of latched OPTO by MCU is around 10µs



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