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MP2696B Datasheet(PDF) 30 Page - MPS Industries, Inc. |
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MP2696B Datasheet(HTML) 30 Page - MPS Industries, Inc. |
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30 / 34 page ![]() MP2696B – SW CHARGER WITH I2C CONTROL, BOOST OUTPUT MP2696B Rev. 1.0 MonolithicPower.com 30 4/16/2021 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2021 MPS. All Rights Reserved. Compensate the Current-Sense Resistor The soldering tin has resistance. For a 10m Ω resistor soldered on the PCB, the total resistance between the resistor pads is between 11m Ω and 12mΩ. One method to compensate for this resistance consists of applying a resistor divider to the CSP/BATT pins (see Figure 15). SW BATT MP2696B L1 CBATT RS1 CSP 10 Ω R1 Figure 15: Current-Sense Compensation After the PCB is assembled, apply a 2A DC current source between SW and BATT. Measure the voltage drop across the current- sense resistor on its PCB pads (VCS). Calculate R1 with Equation (12): CS V 2 RS1 R1 10 2 RS1 (12) PCB Layout Guidelines Efficient PCB layout is critical to meet specified noise, efficiency, and stability requirements. For the best results, follow the guidelines below: 1. Place the PMID capacitor as close as possible to the PMID and PGND pins using a short copper plane connection. Place the PMID capacitor on the same layer as the IC. 2. Minimize the high-frequency current path loop between the PMID capacitor and the switching power MOSFETs (PMID pin to capacitor, capacitor to PGND pin). 3. Connect the IC’s power pin to as many copper planes as possible to conduct heat away from the IC. 4. Place decoupling capacitors (e.g. the VCC pin capacitor) as close as possible to the IC pins, and make the connection as short as possible. 5. Ensure the number and physical size of the vias is sufficient for a current path. |
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