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TLK1221 Datasheet(PDF) 7 Page - Texas Instruments

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Part # TLK1221
Description  ETHERNET TRANSCEIVER
PDF  23 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLK1221 Datasheet(HTML) 7 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
TLK1221
SLLS713 – FEBRUARY 2007
Table 2. TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
Synchronous function enable. When SYNCEN is high, the internal synchronization function
I
is activated. When this function is activated, the transceiver detects the comma pattern
SYNCEN
32
P/U (2)
(0011 111 negative beginning disparity) in the serial data stream and realigns data on byte
boundaries if required. When SYNCEN is low, serial input data is unframed in RD0–RD9.
Synchronous detect. The SYNC output is asserted high upon detection of the comma
pattern in the serial data path. SYNC pulses are output only when SYNCEN is activated
SYNC/PASS
30
O
(asserted high). In PRBS test mode (PRBSEN = high), SYNC/PASS outputs the status of
the PRBS test results (high = pass).
TEST
Loop enable. When LOOPEN is high (active), the internal loopback path is activated. The
transmitted serial data is directly routed to the inputs of the receiver. This provides a self-test
I
LOOPEN
15
capability in conjunction with the protocol device. The TXP and TXN outputs are held in a
P/D(3)
high-impedance state during the loopback test. LOOPEN is held low during standard
operational state with external serial outputs and inputs active.
PRBS enable. When PRBSEN is high, the PRBS generation circuitry is enabled. The PRBS
I
verification circuit in the receive side is also enabled. A PRBS signal can be fed to the
PRBSEN
31
P/D(3)
receive inputs and checked for errors, which are reported by the SYNC/PASS terminal
indicating low.
When this terminal is low, the device is disabled for Iddq testing. RD0–RD9, RBCn, TXP and
I
ENABLE
1
TXN are high-impedance. The pullup and pulldown resistors on any input are disabled.
P/D(2)
When ENABLE is high, the device operates normally.
POWER
VDD
6, 16, 26
Supply
Digital logic power. Provides power for all digital circuitry and digital I/O buffers
Analog power. VDDA provides power for the high-speed analog circuits, receiver, and
VDDA
37
Supply
transmitter.
VDDPLL
36
Supply
PLL power. Provides power for the PLL circuitry. This terminal requires additional filtering.
GROUND
GNDA
35, 40
Ground
Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX.
GNDQFN
PAD
Ground
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers
(2)
P/U = Internal pullup resistor
(3)
P/D = Internal pulldown resistor
over operating free-air temperature range (unless otherwise noted)
VALUE(1)
UNIT
VDD
Supply voltage(2)
–0.3 to 3
V
VI
Input voltage range at TTL terminals
–0.5 to 4
V
VI
Input voltage range at other terminals
–0.3 to VDD + 0.3
V
ESD
Electrostatic discharge
CDM: 1, HBM: 2
kV
Tstg
Storage temperature
–65 to 150
°C
TA
Characterized free-air temperature range
–40 to 85
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
PACKAGE
POWER RATING
ABOVE TA = 25°C
POWER RATING
POWER RATING
RHA(1)(2)
2.85 W
28 mW/
°C
1.57 W
1.4 W
(1)
The thermal resistance junction to ambient of the RHA package is 35
°C/W measured on a high-K board.
(2)
The thermal resistance junction-to-case (exposed pad) of the RHA package is 5
°C/W.
7
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