ZU/ZT-48

ZU/ZT

ZT1R5 ZT3

7 Cleaning

nCleaning is possible by below listed conditions.

n

n

During cleaning to drying (the condition that cleaning liquid is

soaked into the ink of name plate), do not touch on the surface of

name plate.

After cleaning, dry them enough.

Cleaning method

No.

Classification

1

2

3

4

Cleaning agents

Pine Alpha ST–100S (ARAKAWA CHEMICAL CO.)

Clean Through 750H (KAO Corporation)

IPA

Asahiklin AK–225AES (ASAHI GLASS CO.)

Water type

Solvent type

No.

1

2

3

4

Cleaning method

Liquid Temp.

Varnishing or Ultra

sonic wave

Less than

60

Period

Within 5

minutes

Within 2

minutes

–

Varnishing,Ultra sonic

wave, Vapor

8 Soldering

n

n

Flow soldering : 260

less than 15 seconds.

Soldering iron : 450

less than 5 seconds.

9 Input/Output Pin

n

n

When too much stress is applied on the input/output pins of the

unit, the internal connection may be weakened. As below Fig.9.1,

avoid applying stress of more than 9.8N (1kgf) on the pins hori-

zontally and more than 19.6N (2kgf) vertically.

When additional stress is expected to be put on the input/output

pins because of vibration or impacts, fix the unit on PCB (using sil-

icone rubber or fixing fittings) to reduce the stress onto the in-

put/output pins.

Less than

9.8N(1kgf)

Less than

9.8N(1kgf)

Less than 19.6N(2kgf)

A part

A

Fig.9.1 Stress onto the pins

10 Peak Current

(Pulse Load)

nIt is possible to supply the pulse current for the pulse load by con-

necting the capacitor externally at the output side.

nThe average current Iav of output is shown in below formula.

(Iop - Is) t

T

Iav=Is+

nThe required electrolytic capacitor C is found by below formula.

(Iop - Iav) t

Vo

C=

Instruction

anual

M

DC-DC Converters PCB Mount type

October 08, 2013