6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD

Supply voltage

–0.5

4.0

V

VEN or VSEL

Logic control input pin current (SEL, EN)

–0.5

4.0

V

VD or VS

Source or drain voltage (Sx, Dx)

–0.5

5.5

V

Tstg

Storage temperature

–65

150

°C

TJ

Junction temperature

–40

125

°C

(1)

Operation outside the Absolute Maximum Rating may cause permanent device damage. Absolute Maximum Rating do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Condition. If

used outside the Recommended Operating Condition but within the Absolute Maximum Rating, the device may not be fully functional,

and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

VESD

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±5000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VDD

Power Supply voltage

3.0

3.3

3.6

V

VDDRAMP

Power Supply voltage ramp time

0.1

100

ms

VD or VS

Source or drain voltage (Sx, Dx)

0

3.6

V

VEN or VSEL

Logic control input pin current (SEL, EN)

0

3.6

V

IS or ID (cont)

Source or drain continuous current (Sx, Dx)

90

mA

TA

Operating free-air/ambient temperature

-40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMUX121

UNIT

NKG (UQFN)

10 PINS

RθJA

Junction-to-ambient thermal resistance - High K

225.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

93.5

°C/W

RθJB

Junction-to-board thermal resistance

147.5

°C/W

ψJT

Junction-to-top characterization parameter

3.4

°C/W

ψJB

Junction-to-board characterization parameter

147.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TMUX121

SCDS381 – AUGUST 2023

www.ti.com

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