Rev C Preliminary

Amalfi Confidential

Page 19

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Preliminary Device Specification

AM7808

Figure 6d: Detail

Figure 6 a-d. Recommended PCB, solder mask and solder stencil. Non-solder mask Defined (NSMD) artwork assumed.

All dimensions in mm.

Thermal Pad and Via Design

Thermal vias are required for the PCB layout of the AM7808 to effectively conduct heat away from the package. The via

pattern in Figure 5b was designed with these considerations: thermal, power dissipation, and electrical requirements of

the AM7808 plus PCB routing strategies.

Amalfi Semiconductor uses a via pattern based upon thru-hole vias with 0.203mm to 0.303mm finished hole size with

0.25mm plating for on the via walls. If micro vias are implemented in a design, Amalfi recommends that the number of

vias be increased by a 4:1 ratio in order to achieve equivalent results.