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RDA5876 Datasheet(PDF) 19 Page - RDA Microelectronics, Inc |
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RDA5876 Datasheet(HTML) 19 Page - RDA Microelectronics, Inc |
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19 / 22 page ![]() RDA Microelectronics, Inc. RDA5876 Datasheet V1.2 Page 19 of 22 Figure12-1. 32-Pin 4x4 Quad Flat No-Lead (QFN) 13 PCB Land Pattern Figure13-3.Classification Reflow Profile Table 13-1 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average Ramp-Up Rate (TSmax to Tp) 3 ℃/second max. 3 ℃/second max. Preheat -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (tsmin to tsmax) 100 ℃ 100 ℃ 60-120 seconds 150 ℃ 200 ℃ 60-180 seconds Time maintained above: -Temperature (TL) -Time (tL) 183 ℃ 60-150seconds 217℃ 60-150 seconds Peak /Classification Temperature(Tp) See Table 9-2 See Table 9-3 Time within 5 oC of actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-Down Rate 6 ℃/second max. 6 ℃/seconds max. Time 25 oC to Peak 6 minutes max. 8 minutes max. |
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