RDA Microelectronics, Inc.

RDA5876 Datasheet V1.2

Page 20 of 22

Temperature

Table 13-2

Pb-free Process – Package Peak Reflow Temperatures

Package Thickness

Volume mm3

<350

Volume mm3

≥

350

＜

2.5mm

240 + 0/-5 ℃

225 + 0/-5 ℃

≥

2.5mm

225 + 0/-5 ℃

225 + 0/-5 ℃

Table 13-3

Pb-free Process – Package Classification Reflow Temperatures

Package

Thickness

Volume mm3

＜

350

Volume mm3

350-2000

Volume mm3

＞

2000

＜

1.6mm

260 + 0 ℃ *

260 + 0 ℃ *

260 + 0 ℃ *

1.6mm – 2.5mm

260 + 0 ℃ *

250 + 0 ℃ *

245 + 0 ℃ *

≥

2.5mm

250 + 0 ℃ *

245 + 0 ℃ *

245 + 0 ℃ *

*Tolerance : The device manufacturer/supplier shall assure process compatibility up to and including the

stated classification temperature(this mean Peak reflow temperature + 0 ℃. For example 260+ 0 ℃ )

at the rated MSL Level.

Note 1: All temperature refer topside of the package. Measured on the package body surface.

Note 2: The profiling tolerance is + 0 ℃, - X ℃ (based on machine variation capability)whatever is

required to control the profile process but at no time will it exceed – 5 ℃. The producer assures process

compatibility at the peak reflow profile temperatures defined in Table 13-3.

Note 3: Package volume excludes external terminals(balls, bumps, lands, leads) and/or non integral heat

sinks.

Note 4: The maximum component temperature reached during reflow depends on package the thickness

and volume. The use of convection reflow processes reduces the thermal gradients between packages.

However, thermal gradients due to differences in thermal mass of SMD package may sill exist.

Note 5: Components intended for use in a “lead-free” assembly process shall be evaluated using the

“lead free” classification temperatures and profiles defined in Table13-1, 13-2, 13-3 whether or not lead

free.

RoHS Compliant

The product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls

(PBB) or polybrominated biphenyl ethers (PBDE), and are therefore considered RoHS compliant.

ESD Sensitivity

Integrated circuits are ESD sensitive and can be damaged by static electricity. Proper ESD techniques

should be used when handling these devices.