Electronic Components Datasheet Search
  English  ▼

X  

DLP651LE Datasheet(PDF) 9 Page - Texas Instruments

Part # DLP651LE
Description  DLP651LE 0.65 WXGA Digital Micromirror Device
PDF  41 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

DLP651LE Datasheet(HTML) 9 Page - Texas Instruments

Back Button DLP651LE Datasheet HTML 5Page - Texas Instruments DLP651LE Datasheet HTML 6Page - Texas Instruments DLP651LE Datasheet HTML 7Page - Texas Instruments DLP651LE Datasheet HTML 8Page - Texas Instruments DLP651LE Datasheet HTML 9Page - Texas Instruments DLP651LE Datasheet HTML 10Page - Texas Instruments DLP651LE Datasheet HTML 11Page - Texas Instruments DLP651LE Datasheet HTML 12Page - Texas Instruments DLP651LE Datasheet HTML 13Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 9 / 41 page
background image
6.4 Recommended Operating Conditions (continued)
Over operating free-air temperature range (unless otherwise noted). The functional performance of the device specified in
this data sheet is achieved when operating the device within the limits defined by this table. No level of performance is
implied when operating the device above or below these limits.
MIN NOM
MAX
UNIT
tSCP_PW_ENZ
SCPENZ inactive pulse width (high level)
1
1/ƒscpclk
tr
Rise time (20% to 80%)
200
ns
tf
Fall time (80% to 20%)
200
ns
LVDS INTERFACE
ƒCLOCK
Clock frequency for LVDS interface (all channels), DCLK(7)
320
330
MHz
|VID|
Input differential voltage (absolute value)(8)
100
400
600
mV
VCM
Common mode voltage(8)
1200
mV
VLVDS
LVDS voltage(8)
0
2000
mV
tLVDS_RSTZ
Time required for LVDS receivers to recover from PWRDNZ
10
ns
ZIN
Internal differential termination resistance
95
105
Ω
ZLINE
Line differential impedance (PWB/trace)
90
100
110
Ω
ENVIRONMENTAL
TARRAY
Array temperature, long-term operational(9) (10) (11)
10
40 to 70(12)
°C
Array temperature, short-term operational(10) (13)
0
10
°C
TDP -AVG
Average dew point average temperature (non-condensing)(14)
28
°C
TDP-ELR
Elevated dew point temperature range (non-condensing)(15)
28
36
°C
CTELR
Cumulative time in elevated dew point temperature range
24
Months
QAP-ILL
Window aperture illumination overfill (16)
17
W/cm2
SOLID STATE ILLUMINATION
ILLUV
Illumination power at wavelengths < 410 nm(9) (18)
10 mW/cm2
ILLVIS
Illumination power at wavelengths ≥ 410 nm and ≤800 nm (17) (18)
33.5
W/cm2
ILLIR
Illumination power at wavelengths > 800 nm (18)
10 mW/cm2
ILLBLU
Illumination power at wavelengths ≥ 410 nm and ≤ 475 nm (17) (18)
10.6
W/cm2
ILLBLU1
Illumination power at wavelengths ≥ 410 nm and ≤ 440 nm (17) (18)
1.7
W/cm2
LAMP ILLUMINATION
ILLUV
Illumination power at wavelengths < 395 nm(9) (18)
2 mW/cm2
ILLVIS
Illumination power at wavelengths ≥ 395 nm and ≤ 800 nm (17) (18)
23.5
W/cm2
ILLIR
Illumination power at wavelengths > 800 nm (18)
10 mW/cm2
(1)
All voltages are referenced to common ground VSS. VBIAS, VCC, VCCI, VOFFSET, and VRESET power supplies are all required for proper
DMD operation. VSS must also be connected.
(2)
VOFFSET supply transients must fall within specified max voltages.
(3)
To prevent excess current, the supply voltage delta |VCCI – VCC| must be less than the specified limit. See Section 10 and Figure 10-1.
(4)
PWRDNZ input pin resets the SCP and disables the LVDS receivers. PWRDNZ input pin overrides SCPENZ input pin and tristates the
SCPDO output pin.
(5)
The SCP clock is a gated clock. Duty cycle must be 50% ± 10%. SCP parameter is related to the frequency of DCLK.
(6)
See Figure 6-3.
(7)
See LVDS Timing Requirements in Section 6.7 and Figure 6-7.
(8)
See Figure 6-6 LVDS Waveform Requirements.
(9)
Simultaneous exposure of the DMD to the maximum Section 6.4 for temperature and UV illumination will reduce device lifetime.
(10) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point 1
(TP1) shown in Figure 7-1 and the package thermal resistance using Section 7.5.
(11) Long-term is defined as the usable life of the device.
(12) Per Figure 6-1, the maximum operational array temperature should be derated based on the micromirror landed duty cycle that the
DMD experiences in the end application. See Section 7.8 for a definition of micromirror landed duty cycle.
(13) Array temperatures beyond those specified as long-term are recommended for short-term conditions only (power-up). Short-term is
defined as cumulative time over the usable life of the device and is less than 500 hours.
(14) The average over time (including storage and operating) that the device is not in the "elevated dew point temperature range."
www.ti.com
DLP651LE
DLPS153 – OCTOBER 2023
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
9
Product Folder Links: DLP651LE



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com