AD2426 datasheet(20/38 Pages) AD

20 / 38 page

Rev. F

Page 20 of 38

November 2023

AD2426/AD2427/AD2428

ABSOLUTE MAXIMUM RATINGS

Stresses at or above those listed in Table 12 can cause perma-

nent damage to the product. This is a stress rating only;

functional operation of the product at these or any other condi-

tions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum

operating conditions for extended periods may affect product

reliability.

Permanent damage can occur if the digital pin output current

per pin group value is exceeded. For example, if three pins from

Group 2 in Table 13 are sourcing or sinking 2 mA each, the total

current for those pins is 6 mA. Up to 9 mA can be sourced or

sunk by the remaining pins in the group without damaging the

device.

THERMAL CHARACTERISTICS

The JESD51 package thermal characteristics in this section are

provided for package comparison and estimation purposes only.

They are not intended for accurate system temperature calcula-

tion. System thermal simulation is required for accurate

temperature analysis that accounts for all specific 3D system

design features, including, but not limited to other heat sources,

use of heat sinks, and the system enclosure. Contact Analog

Devices for package thermal models that are intended for use

with thermal simulation tools.

To determine the junction temperature on the application

printed circuit board (PCB), use the following equations:

TJ = TCASE + ΨJT × PD

where:

TJ = junction temperature (°C).

TCASE = case temperature (°C) measured by customer at top cen-

ter of package.

ΨJT = values in Table 14.

PD = power dissipation.

Values of JA are provided for package comparison and PCB

design considerations. Use JA for a first-order approximation

of TJ by the following equation:

TJ = TA + JA × PD

where TA = ambient temperature (°C).

Values of JC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of JB are provided for package comparison and PCB

design considerations.

Thermal characteristics of the LFCSP_SS package are shown in

Table 14. See JESD51-13 for detailed parameter definitions.

The junction to board measurement complies with JESD51-8.

The junction to case measurement complies with MIL-STD-883

(Method 1012.1). All measurements use a 2S2P JEDEC test

board.

Table 12. Absolute Maximum Ratings

Parameter

Rating

VIN to VSS

–0.7 V to +30 V

Power Supply IOVDD to VSS

–0.3 V to +3.63 V

Power Supply DVDD to VSS

–0.3 V to +1.98 V

Power Supply PLLVDD to VSS

–0.3 V to +1.98 V

Power Supply TRXVDD to VSS

–0.3 V to +3.63 V

Digital Pin Output Voltage Swing

1 Applies to BCLK, SYNC, DTX0/IO3, DTX1/DRX1/IO4, DRX0/IO5, DRX1/IO6,

IRQ/IO0, ADR1/IO1, ADR2/IO2, PDMCLK/IO7.

–0.3 V to VIOVDD + 0.5 V

Input Voltage2, 3

2 Only applies when the related power supply (VIOVDD) is within specification. When

the power supply is below specification, the range is the voltage being applied to

that power domain ± 0.2 V.

3 Applies when nominal VIOVDD is 3.3 V.

–0.33 V to +3.63 V

Input Voltage2, 4

4 Applies when nominal VIOVDD is 1.8 V.

–0.33 V to +2.10 V

2C Input Voltage2, 5

5 Applies to SCL and SDA.

–0.33 V to +5.5 V

A2B Bus Terminal Voltage

AP, AN, BP, and BN Pins

–0.5 V to +4.1 V

SENSE, SWP, VSSN Voltage to VSS

+30 V maximum

Storage Temperature Range

–65°C to +150°C

Junction Temperature While Biased

–40°C to +125°C

ESD Rating HBM

VIN and SWP Pins

±2.5 kV

AP, AN, BP, and BN Pins

±2.5 kV

All Other Pins

±2.5 kV

ESD Rating FICDM

All Pins

±1.25 kV

System ESD Rating CON1-A and CON1-B

Terminals6

6 CON1-A and CON1-B are connectors.

Refer to System ESD

Rating in Table 9.

Digital Pin Output Current per Pin Group

7 For more information, see the following description and Table 13.

15 mA

Table 13. Total Current Pin Groups

Group

Pins in Group

IRQ/IO0, ADR1/IO1, ADR2/IO2

BCLK, SYNC, DTX0/IO3, DTX1/DRX1/IO4, DRX0/IO5,

DRX1/IO6, PMDCLK/IO7

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