TDA8360 datasheet(31/36 Pages) PHILIPS

31 / 36 page

March 1994

Philips Semiconductors

Objective speciﬁcation

Integrated PAL and PAL/NTSC TV

processors

TDA8360; TDA8361; TDA8362

PACKAGE OUTLINE

Fig.14 52-lead shrink dual in-line; plastic (SOT247AG).

Dimensions in mm.

handbook, full pagewidth

1.3 max

14.1

13.7

47.92

47.02

4.57

max

5.08

max

0.51

min

3.2

2.8

0.18 M

0.53

max

1.778

(25x)

1.73

max

15.80

15.24

0.32 max

15.24

17.15

15.90

MSA267

SOLDERING

Plastic dual in-line packages

BY DIP OR WAVE

The maximum permissible temperature of the solder is

260

°C; this temperature must not be in contact with the

joint for more than 5 s. The total contact time of successive

solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has

been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within

the permissible limit.

REPAIRING SOLDERED JOINTS

Apply the soldering iron below the seating plane (or not

more than 2 mm above it). If its temperature is below

300

°C, it must not be in contact for more than 10 s; if

between 300 and 400

°C, for not more than 5 s.

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