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HV7358 Datasheet(PDF) 13 Page - Microchip Technology

Part # HV7358
Description  16-Channel, 3-Level HV Ultrasound Transmitter with Built-in Transmit Beamformer
PDF  50 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

HV7358 Datasheet(HTML) 13 Page - Microchip Technology

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 2018 Microchip Technology Inc.
DS20005918A-page 13
HV7358
TABLE 1-12:
SPI AND I2C I/O CHARACTERISTICS
Unless otherwise specified: VLL =+2.5V, AVDD =VDD =+5V, VPP =+80V, VNN =-80V, VGN = -5V, VSUB =0V, EN = 1,
TA =+25°C
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
LVDS Differential Input: CLKP/N, SDIP/N, CSP/N and TRIGP/N Pins
SPI LVDS Clock I/O Frequency
fCLK
30
—
200
MHz
SPI LVDS Clock Input Duty Cycle(1)
D%
45
50
55
%
AC Differential Sensitivity
VSNS
150
200
—
mV
P-P at 200 MHz(1)
AC Common-Mode Voltage(1)
VCMAC
1—
1.4
V
DC Common-Mode Voltage
VREF
VLL/2 – 0.2 VLL/2
VLL/2 + 0.2
V
CLK Input Offset Voltage(1)
VOFFSET
—30
—
mV
LVDS DC Input Differential Voltage
VID
100
350
600
mV
Same as FPGA I/O
CLK Input Resistance
RIN_CLK
—5.0
—
kΩ
CLK Input Capacitance(2)
CIN_CLK
—4.0
—
pF
CLK Input Bias Current
IBIAS_CLK
—
1.0
—
mA
At input 200 mVp-p
LVDS Differential Output: CKOP/N, SDOP/N and CSOP/N Pins
LVDS DC Output Differential Voltage
VOD
300
500
—
mV
RT =100Ω,
termination resistor
at the P to N LVDS
input pins(2)
LVDS DC Output Common-Mode
Voltage
VOCM
VLL/2 – 0.2 VLL/2
VLL/2 + 0.2
V
LVDS Output High Voltage for P&N Pins
VOH
—
1.38
1.6
V
LVDS Output Low Voltage for P&N Pins
VOL
0.9
1.03
—
V
Output Current for P&N Pins
IO_LVDS
±3.0
±3.5
±5.0
mA
Output Rise Time
tRO
—1.5
—
ns
Output Fall Time
tFO
—1.5
—
ns
CKOP/N Output Clock Duty Cycle
D%CKO
49.5
50
50.5
%
At 200 MHz(2)
Output Rise Propagation Delay
tDRO
—
1.5
2.0
ns
CKOP 50% to CKN
50%(2)
Output Fall Propagation Delay
tDFO
—1.5
2.0
ns
BEN Enable Time
tBEN
—
0.7
1.0
ns
BEN 50% to CLK
CKO, SDO and CSO Logic High
VOHO
1.95
—
—
V
CKO, SDO and CSO Logic Low
VOLO
——
0.35
V
Note 1:
Characterized only; not 100% tested in production.
2:
Design guidance only.
3:
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to as the VIHmin
of the SCL signal) in order to bridge the undefined region of the falling edge of SCL.
4:
The maximum tHD,DAT only has to be met if the device does not stretch the LOW period (tLOW) of the SCL
signal.
5:
A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement of a
tSU,DAT of 250 ns must then be met. This will automatically be the case if the device does not stretch the
LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must out-
put the next data bit to the SDA line, tRmax +tSU,DAT = 1000 + 250 = 1250 ns (according to the Standard
mode I2C bus specification), before the SCL line is released.
6:
The maximum tF for the SDA and SCL bus lines of 300 ns is longer than the specified maximum tof for the
output stages, 250 ns. This allows series protection resistors (Rs) to be connected between the SDA/SCL
pins and the SDA/SCL bus lines.
7:
I/O pins of Fast mode devices must not obstruct the SDA and SCL lines if VLL is switched off.



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