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HV7358 Datasheet(PDF) 13 Page - Microchip Technology |
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HV7358 Datasheet(HTML) 13 Page - Microchip Technology |
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13 / 50 page ![]() 2018 Microchip Technology Inc. DS20005918A-page 13 HV7358 TABLE 1-12: SPI AND I2C I/O CHARACTERISTICS Unless otherwise specified: VLL =+2.5V, AVDD =VDD =+5V, VPP =+80V, VNN =-80V, VGN = -5V, VSUB =0V, EN = 1, TA =+25°C Parameters Sym. Min. Typ. Max. Units Conditions LVDS Differential Input: CLKP/N, SDIP/N, CSP/N and TRIGP/N Pins SPI LVDS Clock I/O Frequency fCLK 30 — 200 MHz SPI LVDS Clock Input Duty Cycle(1) D% 45 50 55 % AC Differential Sensitivity VSNS 150 200 — mV P-P at 200 MHz(1) AC Common-Mode Voltage(1) VCMAC 1— 1.4 V DC Common-Mode Voltage VREF VLL/2 – 0.2 VLL/2 VLL/2 + 0.2 V CLK Input Offset Voltage(1) VOFFSET —30 — mV LVDS DC Input Differential Voltage VID 100 350 600 mV Same as FPGA I/O CLK Input Resistance RIN_CLK —5.0 — kΩ CLK Input Capacitance(2) CIN_CLK —4.0 — pF CLK Input Bias Current IBIAS_CLK — 1.0 — mA At input 200 mVp-p LVDS Differential Output: CKOP/N, SDOP/N and CSOP/N Pins LVDS DC Output Differential Voltage VOD 300 500 — mV RT =100Ω, termination resistor at the P to N LVDS input pins(2) LVDS DC Output Common-Mode Voltage VOCM VLL/2 – 0.2 VLL/2 VLL/2 + 0.2 V LVDS Output High Voltage for P&N Pins VOH — 1.38 1.6 V LVDS Output Low Voltage for P&N Pins VOL 0.9 1.03 — V Output Current for P&N Pins IO_LVDS ±3.0 ±3.5 ±5.0 mA Output Rise Time tRO —1.5 — ns Output Fall Time tFO —1.5 — ns CKOP/N Output Clock Duty Cycle D%CKO 49.5 50 50.5 % At 200 MHz(2) Output Rise Propagation Delay tDRO — 1.5 2.0 ns CKOP 50% to CKN 50%(2) Output Fall Propagation Delay tDFO —1.5 2.0 ns BEN Enable Time tBEN — 0.7 1.0 ns BEN 50% to CLK CKO, SDO and CSO Logic High VOHO 1.95 — — V CKO, SDO and CSO Logic Low VOLO —— 0.35 V Note 1: Characterized only; not 100% tested in production. 2: Design guidance only. 3: A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to as the VIHmin of the SCL signal) in order to bridge the undefined region of the falling edge of SCL. 4: The maximum tHD,DAT only has to be met if the device does not stretch the LOW period (tLOW) of the SCL signal. 5: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement of a tSU,DAT of 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must out- put the next data bit to the SDA line, tRmax +tSU,DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line is released. 6: The maximum tF for the SDA and SCL bus lines of 300 ns is longer than the specified maximum tof for the output stages, 250 ns. This allows series protection resistors (Rs) to be connected between the SDA/SCL pins and the SDA/SCL bus lines. 7: I/O pins of Fast mode devices must not obstruct the SDA and SCL lines if VLL is switched off. |
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