TMP114 datasheet(32/41 Pages) TI

32 / 41 page

For more information on board layout, refer to the related Precise temperature measurements with TMP116 and

TMP117 (SNOA986) and Wearable temperature-sensing layout considerations optimized for thermal response

(SNIA021) application notes on ti.com.

1. If the device is used to measure solid surface temperature:

• Use PCB with minimal thickness.

• Prevent PCB bending which can create a mechanical stress to package.

• Cover bottom of the PCB with copper plane.

• Remove bottom solder mask and cover exposed copper with gold layer if possible.

• Use thermal conductive paste between PCB and object surface.

• If PCB has unused internal layers, extend these layers under the sensor.

• Minimize amount of copper wires on top of the board.

• To minimize temperature “leakage” to surrounding air locate sensor in place with minimal air movement.

Horizontal surfaces are preferable.

• To minimize temperature offset due to “leakage” to surrounding air cover sensor with thermo isolating

foam, tape or at least cover with a stain.

2. If the device is used to measure moving air temperature:

• Because moving air temperature typically has a lot of fluctuations the PCB increased thermal mass

reduces measurement noise.

• Use a PCB with thicker copper layers if possible.

• Cover both side of unused board space with copper layer.

• Place PCB vertically along air flow.

3. If the device is used to measure still air temperature:

• Miniaturize the board to reduce thermal mass. Smaller thermal mass results in faster thermal response.

• Remove the top solder mask.

• To prevent oxidation, cover any exposed copper with solder paste.

• Thermal isolation is required to avoid thermal coupling from heat source components through the PCB.

• Avoid running the copper plane underneath the temperature sensor.

• Maximize the air gap between the sensor and the surrounding copper areas (anti-etch), especially when

close to the heat source.

• Create a PCB cutout between sensor and other circuits.

• If the heat source is top side, avoid running traces on top; instead, route all signals on the bottom side.

• Place the board vertically to improve air flow and to reduce dust collection.

9.4.2 Layout Examples

SDA

SCL

PULLUP

GND

Via to Power Plane

Via to GND Plane

10nF

Figure 9-3. YMS Layout Recommendation

TMP118

SNIS237 – DECEMBER 2024

www.ti.com

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TMP114 Datasheet(PDF) 32 Page - Texas Instruments

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