TMP114 datasheet(30/41 Pages) TI

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9 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

9.1 Application Information

The TMP118 is used to measure the temperature of the mounting location. The different address options allow

up to four TMP118 sensors on a single serial bus. For more information, refer to the related Considerations for

Measuring Ambient Air Temperature (SNOA966), Replacing resistance temperature detectors with the TMP116

temp sensor (SNOA969), and Temperature sensors: PCB guidelines for surface mount devices (SNOA967)

application reports on ti.com.

9.2 Typical Application

9.2.1 Separate I2C Pullup and Supply Application

VDD

SCL

SDA

GND

10 nF

SDA

SCL

TMP118

Controller

Heat Source

PULLUP

Figure 9-1. Separate I2C Pullup and Supply Voltage Application

9.2.1.1 Design Requirements

For this design example, use the parameters listed below.

Table 9-1. Design Parameters

PARAMETER

VALUE

Supply (VDD)

1.4V to 5.5V

VPULLUP

1.2V

RPULLUP

VPULLUP / 1mA

TMP118

SNIS237 – DECEMBER 2024

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