Not to scale

1

REF

8

NC

2

–IN

7

V+

3

+IN

6

OUT

4

V–

5

NC

3

INA148-Q1

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SBOS472B – MARCH 2009 – REVISED JUNE 2016

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5 Pin Configuration and Functions

D Package

8-Pin SOIC

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

+IN

3

I

Noninverting input

–IN

2

I

Inverting input

NC

5, 8

—

No connection

OUT

6

O

Output voltage

REF

1

I

Reference voltage input

V+

7

I

Positive supply voltage

V–

4

I

Negative supply voltage

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

V+ to V–

36

V

Input voltage

Continuous

±200

V

Peak (0.1 s)

±500

Short circuit to ground duration

Continuous

Package thermal impedance, junction to free air

97.1

°C/W

Operating free-air temperature

–40

125

°C

Maximum operating virtual-junction temperature

150

°C

Lead temperature (soldering, 10 s)

300

°C

Storage temperature, Tstg

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±1500

V

Charged-device model (CDM), per AEC Q100-011

±2000

Machine model

±150