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LM19 Datasheet(PDF) 3 Page - Texas Instruments

Part # LM19
Description  LM19 2.4V, 10μA, TO-92 Temperature Sensor
PDF  15 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM19 Datasheet(HTML) 3 Page - Texas Instruments

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LM19
www.ti.com
SNIS122E – MAY 2001 – REVISED MARCH 2013
Absolute Maximum Ratings
(1)
Supply Voltage
+6.5V to
−0.2V
Output Voltage
(V+ + 0.6 V) to
−0.6 V
Output Current
10 mA
Input Current at any pin(2)
5 mA
Storage Temperature
−65°C to +150°C
Maximum Junction Temperature (TJMAX)
+150°C
ESD Susceptibility(3)
Human Body Model
2500 V
Machine Model
250 V
Lead Temperature
TO-92 Package
Soldering (3 seconds dwell)
+240°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2)
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V
+), the current at that pin should be limited to 5 mA.
(3)
The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Ratings
(1)
Specified Temperature Range
TMIN ≤ TA ≤ TMAX
2.4 V
≤ V+≤ 2.7 V
−30°C ≤ TA ≤ +130°C
2.7 V
≤ V+≤ 5.5 V
−55°C ≤ TA ≤ +130°C
Supply Voltage Range (V+)
+2.4 V to +5.5 V
Thermal Resistance,
θJA
(2)
TO-92
150°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2)
The junction to ambient thermal resistance (
θJA) is specified without a heat sink in still air.
Copyright © 2001–2013, Texas Instruments Incorporated
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