TMP116 datasheet(37/46 Pages) TI2

37 / 46 page

TMP116, TMP116N

www.ti.com

SBOS740A – MAY 2017 – REVISED MAY 2019

Product Folder Links: TMP116

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Layout Guidelines (continued)

a standard PCB reflow oven process is highly recommended.

2. If the device is used to measure solid surface temperature:

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Use PCB with minimal thickness.

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Prevent PCB bending which can create a mechanical stress to package.

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Cover bottom of the PCB with copper plane.

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Remove bottom solder mask and cover exposed copper with gold layer if possible.

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Use thermal conductive paste between PCB and object surface.

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If PCB has unused internal layers, extend these layers under the sensor.

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Minimize amount of copper wires on top of the board.

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To minimize temperature “leakage” to surrounding air locate sensor in place with minimal air movement.

Horizontal surfaces are preferable.

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To minimize temperature offset due to “leakage” to surrounding air cover sensor with thermo isolating

foam, tape or at least cover with a stain.

3. If the device is used to measure moving air temperature:

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Because moving air temperature usually has a lot of fluctuations the PCB increased thermal mass

reduces measurement noise.

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Design PCB soldering pads bigger than usual, especially package corner pads.

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Use a PCB with thicker copper layers if possible.

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Cover both side of unused board space with copper layer.

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Place PCB vertically along air flow.

4. If the device is used to measure still air temperature:

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Miniaturize the board to reduce thermal mass. Smaller thermal mass results in faster thermal response.

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Place two copper planes of equal size to the top and bottom of the exposed pad.

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Remove the top solder mask.

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To prevent oxidation, cover any exposed copper with solder paste.

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Thermal isolation is required to avoid thermal coupling from heat source components through the PCB.

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Avoid running the copper plane underneath the temperature sensor.

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Maximize the air gap between the sensor and the surrounding copper areas (anti-etch), especially when

close to the heat source.

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Create a PCB cutout between sensor and other circuits. Leave a narrow channel away from heat source

components as a routing bridge into the island.

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If the heat source is top side, avoid running traces on top; instead, route all signals on the bottom side.

–

Place the board vertically to improve air flow and to reduce dust collection.

TMP116 Datasheet(PDF) 37 Page - Texas Instruments

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