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SY75608 Datasheet(PDF) 34 Page - Microchip Technology |
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SY75608 Datasheet(HTML) 34 Page - Microchip Technology |
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34 / 44 page ![]() SY75608/612 DS20006363D-page 34 2021 - 2023 Microchip Technology Inc. and its subsidiaries RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 4.20 4.20 MILLIMETERS 0.40 BSC MIN E MAX 5.90 Contact Pad Length (X48) Contact Pad Width (X48) Y1 X1 0.85 0.20 NOM C1 0 9 . 5 g n i c a p S d a P t c a t n o C Contact Pad to Center Pad (X48) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Contact Pad to Contact Pad (X44) G2 0.20 C1 C2 EV EV X2 Y2 Y1 X1 G1 G2 ØV 1 2 48 E SILK SCREEN Microchip Technology Drawing C04-2494 Rev A 48-Lead Very Thin Plastic Quad Flat, No Lead (6LX) - 6x6 mm Body [VQFN] With 4.1x4.1 mm Exposed Pad |
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