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SY75608 Datasheet(PDF) 37 Page - Microchip Technology

Part # SY75608
Description  8 or 12 Output Ultra-Low Additive Jitter
PDF  44 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SY75608 Datasheet(HTML) 37 Page - Microchip Technology

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2021 - 2023 Microchip Technology Inc. and its subsidiaries
DS20006363D-page 37
SY75608/612
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
4.25
4.25
MILLIMETERS
0.50 BSC
MIN
E
MAX
7.90
Contact Pad Length (X56)
Contact Pad Width (X56)
Y1
X1
0.85
0.30
NOM
1
2
56
C1
0
9
.
7
g
n
i
c
a
p
S
d
a
P
t
c
a
t
n
o
C
Contact Pad to Contact Pad (X52)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Contact Pad to Center Pad (X56)
G1
0.85
Microchip Technology Drawing C04-27665 Rev A
C1
C2
EV
EV
Y2
X2
X1
G2
SILK SCREEN
E
Y1
G1
ØV
56-Lead Very Thin Plastic Quad Flat, No Lead Package (K3C) - 8x8x1.0 mm Body [VQFN]
With 4.15 mm Exposed Pad



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