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SY75608 Datasheet(PDF) 11 Page - Microchip Technology |
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SY75608 Datasheet(HTML) 11 Page - Microchip Technology |
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11 / 44 page  2021 - 2023 Microchip Technology Inc. and its subsidiaries DS20006363D-page 11 SY75608/612 Repeated Start Condition Setup Time tSU:STA 0.6 — — µs — Stop Condition Setup Time tSU:STO 0.6 — — µs — Data Hold Time tHD:DAT 0 — 0.9 µs Note 4 Data Setup Time tSU:DAT 100 — — ns — Clock Low Period tLOW 1.3 — — µs — Clock High Period tHIGH 0.6 — — µs — Clock/Data Fall Time tF 20 + 0.1*Cb — 250 ns Note 2 Clock/Data Rise Time tR 20 + 0.1*Cb — 250 ns Note 2 Note 1: 3V to 5V ±10%. 2: Rise and fall time is defined as follows: tR = (VIL,MAX – 0.15) to (VIH,MIN + 0.15); tF = (VIH,MIN – 0.15) to (VIL,MAX + 0.15) 3: Devices must provide a means to reject noise spikes of a duration up to the maximum specified value. 4: The maximum hold time has to be less than the maximum data valid or data valid acknowledge time as per Table 10, note [4] of I2C bus Rev. 6 specification. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Ambient Operating Temperature Range TA –40 — +105 °C — Storage Temperature Range TS –65 — +150 °C — Package Thermal Resistances Junction to Ambient Thermal Resistance 6x6 VQFN-48Ld ƟJA — 29 — °C/W Still-Air — 24 — °C/W 1 m/s airflow — 22 — °C/W 2.5 m/s airflow Junction to Board Thermal Resistance 6x6 VQFN-48Ld ƟJB — 8 — °C/W — Junction to Case Thermal Resistance 6x6 VQFN-48Ld ƟJC — 18 — °C/W — Thermal Characterization, Junction to Top of Package 6x6 VQFN-48Ld ΨJB — 1 — °C/W Still-Air Junction to Ambient Thermal Resistance 8x8 VQFN-56Ld ƟJA — 28 — °C/W Still-Air — 23 — °C/W 1 m/s airflow — 22 — °C/W 2.5 m/s airflow Junction to Board Thermal Resistance 8x8 VQFN-56Ld ƟJB — 8 — °C/W — Junction to Case Thermal Resistance 8x8 VQFN-56Ld ƟJC — 14 — °C/W — Thermal Characterization, Junction to Top of Package 8x8 VQFN-56Ld ΨJB — 1 — °C/W Still-Air I2C BUS ELECTRICAL CHARACTERISTICS (CONTINUED) Parameter Symbol Min. Typ. Max. Units Conditions |
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