LM3248

SNVSA01A – JULY 2013 – REVISED SEPTEMBER 2013

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ABSOLUTE MAXIMUM RATINGS

(1) (2)

VBATT pins to GND (PVIN_BOOST, VDD_BOOST, SW_BOOST, PVIN_BUCK,

VDD1_BUCK, VDD2_BUCK, SW_BUCK, ACB, SGND_BOOST, SGND_BUCK, BGND,

PGND)

−0.2V to +6.0V

BOOST_GATE, MODE, ENABLE, OUT_BOOST, FB_BUCK, VCON

(GND

−0.2V to PVIN_BOOST +0.2V)

Junction Temperature (TJ-MAX)

+150°C

Storage Temperature Range

−65°C to +150°C

Continuous Power Dissipation (3)

Internally Limited

Maximum Lead Temperature

(Soldering, 10 sec)

+260°C

ESD Rating (4)

Human Body Model

2 kV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins. The LM3248 is designed for mobile phone applications where turn-on after

power-up is controlled by the system controller, and where requirements for a small package size overrule increased die size for internal

Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds

2.5V.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ < 130°C (typ.).

(4)

The Human Body Model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. (MIL-STD-883 3015.7)

RECOMMENDED OPERATING CONDITIONS

(1)

Input Voltage Range VBATT

2.7V to 5.5V

Boost Output, Buck Input Range

2.7V to 5.5V

Recommended Load Current

0A to 2.5A

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

−30°C to +90°C

(1)

All voltages are with respect to the potential at the GND pins. The LM3248 is designed for mobile phone applications where turn-on after

power-up is controlled by the system controller, and where requirements for a small package size overrule increased die size for internal

Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds

2.5V.

THERMAL PROPERTIES

Junction-to-Ambient Thermal Resistance (

θJA)

(1)

30-bump DSBGA

38°C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7 and is board dependent.

4

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