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LM5030 Datasheet(PDF) 3 Page - Texas Instruments

Part # LM5030
Description  LM5030 100-V Push-Pull Current Mode PWM Controller
PDF  32 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM5030 Datasheet(HTML) 3 Page - Texas Instruments

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VFB
VCC
OUT1
VIN
COMP
OUT2
GND
CS
RT
SS
LM5030
www.ti.com
SNVS215D – APRIL 2003 – REVISED NOVEMBER 2015
5 Pin Configuration and Functions
DGS, DPR Package
10-Pin VSSOP, WSON
Top View
Pin Functions
PIN
I/O
DESCRIPTION
APPLICATION INFORMATION
NAME
NO.
There is an internal 5-k
Ω pullup resistor on this pin. The
COMP
3
O
Output to the error amplifier
error amplifier provides an active sink.
Current sense input for current mode control and current
limit sensing. Using separate dedicated comparators, if CS
CS
8
I
Current sense input
exceeds 0.5 V, the outputs will go into cycle-by-cycle
current limit. If CS exceeds 0.625 V the outputs will be
disabled and a softstart commenced.
GND
7
—
Return
Ground
OUT1
5
O
Output of the PWM controller
Alternating PWM output gate driver
OUT2
6
O
Output of the PWM controller
Alternating PWM output gate driver
An external resistor sets the oscillator frequency. This pin
Oscillator timing resistor pin and
RT
9
I
will also accept synchronization pulses from an external
synchronization input
oscillator.
A 10-µA current source and an external capacitor set the
softstart timing length. The controller will enter a low power
SS
10
I
Dual purpose soft start and shutdown pin
state if the SS pin is pulled below the typical shutdown
threshold of 0.45 V.
VIN
1
I
Source input voltage
Input to start-up regulator. Input range 14 to 100 V.
The non-inverting input is internally connected to a 1.25-V
VFB
2
I
Inverting input to the error amplifier
reference.
Output from the internal high-voltage series
If an auxiliary winding raises the voltage on this pin above
VCC
4
I/O
pass regulator. The regulation setpoint is
the regulation setpoint, the internal series pass regulator
7.7 V.
will shutdown, reducing the IC power dissipation.
The exposed die attach pad on the WSON package should
be connected to a PCB thermal pad at ground potential.
WSON
SUB
—
Die substrate
For additional information on using TI's No Pull Back
DAP
WSON package, refer to WSON Application Note AN-1187
(SNOA401).
Copyright © 2003–2015, Texas Instruments Incorporated
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