LM5030

SNVS215D – APRIL 2003 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN to GND (Survival)

–0.3

100

V

VCC to GND (Survival)

–0.3

16

V

RT to GND (Survival)

–0.3

5.5

V

All other pins to GND (Survival)

–0.3

7

V

Power dissipation

Internally Limited

Lead temperature

(soldering 4 seconds)

260

°C

Operating junction temperature

150

°C

Storage temperature, Tstg

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Machine model (MM)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

14

90

V

TJ Operating junction temperature

–40

105

°C

6.4 Thermal Information

LM5030

THERMAL METRIC(1)

DGS (VSSOP)

DPR (WSON)

UNIT

10 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

158.8

38.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

53.6

137.1

°C/W

RθJB

Junction-to-board thermal resistance

74.8

15.2

°C/W

ψJT

Junction-to-top characterization parameter

5.3

0.4

°C/W

ψJB

Junction-to-board characterization parameter

77.6

15.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

4.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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