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SCBU014 Datasheet(PDF) 16 Page - Texas Instruments |
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SCBU014 Datasheet(HTML) 16 Page - Texas Instruments |
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16 / 34 page ![]() www.ti.com 2.4 Bump Specification PO Aluminium Bump R=BumpHeight NI/AU Passivation Layer GoldBump TiW/Gold UnderBumpMetal DiePad IC AU Bump Specification Table 2-8. Bump Specification Parameter Value Bump material NI covered with AU, chemical process AU Bump height 25 μm ±10% 20 μm ± 3 μm Bump hardness >HV 450 HV 35–80 Surface roughness <1 μm <3 μm Shear strength >150 cN >400 cN Note: Contact between the test pads and the antenna is not allowed as it can have an impact on the electrical performance of the transponder. Figure 2-3. Cross Section of Bump 16 Specification SCBU047 (11-09-21-064) – October 2007 Submit Documentation Feedback |
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