Chapter 3

SCBU047 (11-09-21-064) – October 2007

Shipping, Packing and Further Handling

Topic

.................................................................................................. Page

3.1

Low Definition

.......................................................................... 18

3.2

Wafer Identification

................................................................... 18

3.3

Wafer Map File

.......................................................................... 20

3.4

Ink Dot Specification

................................................................. 21

3.5

Packing for Wafers

.................................................................... 22

3.6

Packing for Sawn Wafers

........................................................... 23

3.7

Barcode Label

.......................................................................... 25

3.8

Storage Conditions

................................................................... 25

3.9

Antenna Calculation

.................................................................. 26

SCBU047 (11-09-21-064) – October 2007

Shipping, Packing and Further Handling

17

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