Contents

Preface

............................................................................................................................... 5

1

Introduction

............................................................................................................... 7

1.1

General

............................................................................................................... 8

1.2

System Description

................................................................................................. 8

1.3

Product Description

................................................................................................. 8

1.4

Functional Description

.............................................................................................. 9

1.5

Memory Organization

.............................................................................................. 9

1.6

Command Set

..................................................................................................... 10

1.7

Ordering Information and Part Numbers

....................................................................... 10

2

Specification

............................................................................................................ 11

2.1

Electrical Specification

............................................................................................ 12

2.2

Mechanical Wafer Specification

................................................................................. 13

2.3

Mechanical Die Specification

.................................................................................... 14

2.4

Bump Specification

................................................................................................ 16

3

Shipping, Packing and Further Handling

..................................................................... 17

3.1

Low Definition

...................................................................................................... 18

3.2

Wafer Identification

................................................................................................ 18

3.3

Wafer Map File

.................................................................................................... 20

3.4

Ink Dot Specification

.............................................................................................. 21

3.5

Packing for Wafers

................................................................................................ 22

3.6

Packing for Sawn Wafers

........................................................................................ 23

3.7

Barcode Label

..................................................................................................... 25

3.8

Storage Conditions

................................................................................................ 25

3.9

Antenna Calculation

............................................................................................... 26

4

Regulatory, Safety and Warranty Notices

.................................................................... 29

4.1

Regulatory, Safety and Warranty Notices

...................................................................... 30

4.2

Warranty and Liability

............................................................................................. 30

4.3

Hazards from Electrostatic Discharge ESD

.................................................................... 31

A

Terms and Abbreviations

.......................................................................................... 33

SCBU047 (11-09-21-064) – October 2007

Contents

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