List of Figures

1-1

RFID System With Reader, Antenna and Tag-it HF-I Transponder

................................................... 8

1-2

Memory Organization of the Tag-it HF-I Standard Transponder IC

................................................... 9

2-1

Wafer on FFC

............................................................................................................... 14

2-2

Antenna and Test Pad Location

.......................................................................................... 15

2-3

Cross Section of Bump

.................................................................................................... 16

3-1

Position of Wafer Identification Code

.................................................................................... 18

3-2

Wafer Identification Code 1

............................................................................................... 19

3-3

Wafer Identification Code 2

............................................................................................... 19

3-4

Ink Dot Drawing

............................................................................................................ 21

3-5

Packing of Wafers

.......................................................................................................... 22

3-6

Packing of Sawn Wafers (Multi)

.......................................................................................... 23

3-7

Packing of Sawn Wafers (Single)

........................................................................................ 24

3-8

Barcode Label

.............................................................................................................. 25

3-9

Recommended Operating Range – Impedance vs Antenna Q

...................................................... 27

List of Tables

1-1

Command Set for Tag-it HF-I Standard Transponder IC

............................................................. 10

1-2

Part Numbers

............................................................................................................... 10

2-1

Absolute Maximum Ratings

............................................................................................... 12

2-2

Recommended Operating Conditions

................................................................................... 12

2-3

Electrical Characteristics

.................................................................................................. 12

2-4

General Mechanical Wafer Specification

................................................................................ 13

2-5

Mechanical Wafer Specification After Grinding, Sawing on FFC

.................................................... 13

2-6

Mechanical Die Specification

............................................................................................. 14

2-7

Antenna and Test Pad Location

.......................................................................................... 15

2-8

Bump Specification

......................................................................................................... 16

3-1

Ink Dot Specification

....................................................................................................... 21

3-2

Ink Dot Placement

.......................................................................................................... 21

3-3

Storage Conditions

......................................................................................................... 25

3-4

Antenna System Parameters

............................................................................................. 27

4

List of Figures

SCBU047 (11-09-21-064) – October 2007

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