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SCBU014 Datasheet(PDF) 14 Page - Texas Instruments |
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SCBU014 Datasheet(HTML) 14 Page - Texas Instruments |
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14 / 34 page ![]() www.ti.com 2.3 Mechanical Die Specification Mechanical Die Specification Figure 2-1. Wafer on FFC Table 2-6. Mechanical Die Specification Parameter Value Bond pad metallization material ALCu0.5 % Bond pad metallization thickness 0.95 μm Bond & test pad location Table 2-7 Die dimension (including scribe line) 1080 * 1080 μm ±15 μm Die dimension (excluding scribe line) 996 * 996 μm ±15 μm Top side passivation material SiNi Passivation thickness 1.1 μm Specification 14 SCBU047 (11-09-21-064) – October 2007 Submit Documentation Feedback |
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