TPS62650-Q1

SLVSB62B – MARCH 2012 – REVISED FEBRUARY 2013

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The serial interface is compatible with Standard, Fast/Fast Plus and High-Speed mode I2C specification allowing

transfers at up to 3.4 Mbps. This communication interface is used for dynamic voltage scaling with voltage steps

down to 12.5 mV for setting the output voltage or reprogramming the mode of operation (PFM/PWM or Forced

PWM), for instance.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

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ORDERING INFORMATION

DEFAULT

PACKAGE

I2C ADDRESS BITS

PART

OUTPUT VOLTAGE

OUTPUT VOLTAGE

PACKAGE

ORDERING

MARKING

NUMBER

RANGE

(CC)

VSEL0

VSEL1

A2

A1

TPS62650-

0.75 V to 1.4375 V

1.05 V

1.2 V

0

1

YFF-9

TPS62650TYFFRQ1

Q1

Q1(1)

(1)

The following registers bits are set by internal hardware logic and not user programmable through I2C:

(a) VSEL0[7] = 1

(b) VSEL1[7] = 1

(c) CONTROL1[3:2] = 00

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

MIN

MAX

at VIN, SW(2)

–0.3

7

V

Input Voltage

at FB (2)

–0.3

3.6

V

at EN, VSEL, SCL, SDA (2)

–0.3

VI + 0.3

V

Power dissipation

Internally limited

Operating ambient temperature, TA

(3)

–40

105

°C

Maximum operating junction Temperature, TJ

150

°C

Storage temperature range, Tstg

–65

150

°C

Human-body model (HBM) AEC-Q100 Classification Level H2

2

kV

ESD rating(4)

Charged-device model (CDM) AEC-Q100 Classification Level

750

V

C3B

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is

recommended to operate the device with a maximum junction temperature of 105°C.

(4)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin.

2

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