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OPA694 Datasheet(PDF) 21 Page - Texas Instruments |
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OPA694 Datasheet(HTML) 21 Page - Texas Instruments |
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21 / 37 page ![]() BOARD LAYOUT GUIDELINES OPA3695 www.ti.com ............................................................................................................................................... SBOS355A – APRIL 2008 – REVISED SEPTEMBER 2008 feedback resistor, rather than a direct short, is required for the unity-gain follower application. A Achieving optimum performance with a current-feedback op amp requires a feedback high-frequency amplifier such as the OPA3695 resistor—even in the unity-gain follower requires careful attention to PCB layout parasitics and configuration—to control stability. Good axial metal external component types. Recommendations that film or surface-mount resistors have approximately optimize OPA3695 performance include: 0.2pF in shunt with the resistor. For resistor values greater than 2.0k Ω, this parasitic capacitance can a) Minimize parasitic capacitance to any ac ground add a pole and/or zero below 400MHz that can affect for all of the signal I/O pins. Parasitic capacitance on circuit operation. Keep resistor values as low as the output can cause instability; on the noninverting possible consistent with load driving considerations. input, it can react with the source impedance to cause unintentional bandlimiting. To reduce d) Connections to other wideband devices on the unwanted capacitance, create a window around the PCB may be made with short direct traces or through signal I/O pins in all of the ground and power planes onboard transmission lines. For short connections, around those pins. Otherwise, ground and power consider the trace and the input to the next device as planes should be unbroken elsewhere on the board. a lumped capacitive load. Relatively wide traces (50mils to 100mils, or 1,27mm to 2,54mm) should be b) Minimize the distance (< 0.25” or 6,35mm) from used, preferably with ground and power planes the power-supply pins to high-frequency 0.1 µF opened up around them. Estimate the total capacitive decoupling capacitors. At the device pins, the ground load and set RS from the plot of Recommended RS vs and power-plane layout should not be in close Capacitive Load (Figure 33). Low parasitic capacitive proximity to the signal I/O pins. Avoid narrow power loads (< 4pF) may not need an RS because the and ground traces to minimize inductance between OPA3695 is nominally compensated to operate with a the pins and the decoupling capacitors. The 2pF parasitic load. If a long trace is required, and the power-supply connections should always be 6dB signal loss intrinsic to a doubly-terminated decoupled with these capacitors. Larger (2.2 µF to transmission line is acceptable, implement a matched 6.8 µF) decoupling capacitors, effective at lower impedance transmission line using microstrip or frequency, should also be used on the supply pins. stripline techniques (consult an ECL design handbook These capacitors may be placed somewhat farther for microstrip and stripline layout techniques). A 50 Ω from the device and may be shared among several environment is normally not necessary on board, and devices in the same area of the PCB. in fact, a higher impedance environment improves c) Careful selection and placement of external distortion, as shown in the distortion versus load components preserve the high-frequency plots. With a characteristic board trace impedance performance of the OPA3695. Use resistors that defined based on board material and trace have low reactance at high frequencies. dimensions, a matching series resistor into the trace Surface-mount resistors work best and allow a tighter from the output of the OPA3695 is used, as well as a overall layout. Metal film and carbon composition terminating shunt resistor at the input of the axially-leaded resistors can also provide good destination device. Remember also that the high-frequency performance. Again, keep the leads terminating impedance is the parallel combination of and PCB trace length as short as possible. Never use the shunt resistor and the input impedance of the wirewound type resistors in a high-frequency destination device; this total effective impedance application. The output pin and inverting input pin are should be set to match the trace impedance. If the the most sensitive to parasitic capacitance; therefore, 6dB attenuation of a doubly-terminated transmission always position the series output resistor, if any, as line is unacceptable, a long trace can be close as possible to the output pin. Other network series-terminated at the source end only. Treat the components, such as noninverting input termination trace as a capacitive load in this case and set the resistors, should also be placed close to the package. series resistor value as illustrated in the plot of Where double-side component mounting is allowed, Figure 33. This configuration does not preserve signal place the feedback resistor directly under the integrity as well as a doubly-terminated line. If the package on the other side of the board between the input impedance of the destination device is low, output and inverting input pins. The frequency there will be some signal attenuation as a result of response is primarily determined by the feedback the voltage divider formed by the series output into resistor value, as described previously. Increasing its the terminating impedance. value reduces the bandwidth, while decreasing it gives a more peaked frequency response. The 604 Ω feedback resistor (used in the typical performance specifications at a gain of +2V/V on ±5V supplies) is a good starting point for design. Note that a 909 Ω Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Link(s): OPA3695 |
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