TPS22921, TPS22922, TPS22922B

SLVS749C – NOVEMBER 2008 – REVISED JANUARY 2015

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8 Specifications

8.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

VIN

Input voltage

–0.3

4

V

VOUT

Output voltage

VIN + 0.3

V

VON

Input voltage

–0.3

4

V

P

Power dissipation at TA = 25°C

0.645

W

IMAX

Maximum continuous switch current

2

A

TA

Operating free-air temperature

–40

85

°C

Tlead

Maximum lead temperature (10-s soldering time)

300

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

Electrostatic

V(ESD)

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

V

discharge

Machine model (MM)

±300

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

MAX

UNIT

VIN

Input voltage range

0.9

3.6

V

VOUT

Output voltage range

VIN

V

VIH

High-level input voltage, ON

0.85

3.6

V

VIL

Low-level input voltage, ON

0.4

V

CIN

Input capacitor

1(1)

µF

(1)

Refer to Application Information.

8.4 Thermal Information

TPS22921, TPS22922,

TPS22921

TPS22922B

THERMAL METRIC(1)

UNIT

YFP

YZP

YZT

6 PINS

RθJA

Junction-to-ambient thermal resistance

125.1

131

120.7

RθJC(top)

Junction-to-case (top) thermal resistance

1.4

1.3

2.1

RθJB

Junction-to-board thermal resistance

26

22.6

26.4

°C/W

ψJT

Junction-to-top characterization parameter

0.3

5.2

3.7

ψJB

Junction-to-board characterization parameter

26

22.6

26.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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