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DLPA2000

DLPS043B – JUNE 2014 – REVISED FEBRUARY 2018

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Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

Storage Conditions.................................................... 5

6.3

ESD Ratings.............................................................. 5

6.4

Recommended Operating Conditions ....................... 5

6.5

Thermal Information .................................................. 6

6.6

Electrical Characteristics........................................... 6

6.7

Motor Driver Timing Requirements ......................... 11

6.8

Data Transmission Timing Requirements............... 12

6.9

Typical Characteristics ............................................ 13

7

Detailed Description ............................................ 14

7.1

Overview ................................................................. 14

7.2

Functional Block Diagram ....................................... 15

7.3

Feature Description................................................. 16

7.4

Device Functional Modes........................................ 27

7.5

Register Maps ......................................................... 29

8

Application and Implementation ........................ 41

8.1

Application Information............................................ 41

8.2

Typical Projector Application .................................. 41

8.3

Typical Mobile Sensing Application ....................... 43

9

Power Supply Recommendations ...................... 46

10

Layout................................................................... 47

10.1

Layout Guidelines ................................................. 47

10.2

Layout Example .................................................... 48

11

Device and Documentation Support ................. 49

11.1

Device Support .................................................... 49

11.2

Related Links ........................................................ 49

11.3

Community Resources.......................................... 49

11.4

Trademarks ........................................................... 49

11.5

Electrostatic Discharge Caution ............................ 50

11.6

Glossary ................................................................ 50

12

Mechanical, Packaging, and Orderable

Information ........................................................... 51

4 Revision History

Changes from Revision A (August 2015) to Revision B

Page

•

Fixed body size dimension typo in Device Information, corrected 3.48 mm

2 to 3.48 mm...................................................... 1

•

Added missing history tags to Revision A that were not listed............................................................................................... 1

•

Corrected package family to 'DSBGA' in Pin Functions Diagram, originally labeled as 'DSGBA' ......................................... 3

•

Added mechanical package designator YFF to Thermal Information .................................................................................... 6

•

Changed layout example to show correct image in Figure 46 ............................................................................................. 48

Changes from Original (June 2014) to Revision A

Page

•

Changed max current to 750 mA ........................................................................................................................................... 1

•

Added Mobile Sensing application ........................................................................................................................................ 1

•

Added typical Mobile sensing application ............................................................................................................................ 43

•

Updated the Power Supply Recommendations to remove information that did not apply to the DLPA2000 ..................... 46