6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Supply voltage

Single-supply, VS = (V+)

7

V

Dual-supply, VS = (V+) – (V–)

±3.5

Input voltage

Common-mode

(V–) – 0.3

(V+) + 0.3

V

Differential

(V+) – (V–) +

0.2

Input current

±10

mA

Output short circuit(2)

Continuous

Continuous

TA

Operating temperature

–55

150

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside of Absolute Maximum Ratings may cause permanent damage to the device. Absolute Maximum Ratings do

not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating

Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be

fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002

HBM ESD classification level 2(1)

±2000

V

Charge device model (CDM), per AEC Q100-011

CDM ESD classification level C5

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VS

Supply voltage

1.8

5.5

V

TA

Operating temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

INA333-Q1

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

169.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

62.7

°C/W

RθJB

Junction-to-board thermal resistance

90.3

°C/W

ψJT

Junction-to-top characterization parameter

7.6

°C/W

ψJB

Junction-to-board characterization parameter

88.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA333-Q1

SBOS464B – SEPTEMBER 2019 – REVISED JUNE 2023

www.ti.com

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