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LMV551-Q1

SNOSD24 – FEBRUARY 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

The maximum power dissipation is a function of TJ(MAX), θJA, The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN Differential ( V

+ = 5V)

±2.5

V

Supply voltage (V+ - V−)

6

V

Voltage at input/output pins

V−

− 0.3

V+ + 0.3

V

Junction temperature, TJ

(3)

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Temperature range, TA

(1)

−40

125

°C

Supply voltage (V+ – V−)

2.7

5.5

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LMV551-Q1

UNIT

DCK

(SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

303.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

135.5

°C/W

RθJB

Junction-to-board thermal resistance

81.1

°C/W

ψJT

Junction-to-top characterization parameter

8.4

°C/W

ψJB

Junction-to-board characterization parameter

80.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W