AP22950

Document number: DS47157 Rev. 2 - 2

14 of 15

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May 2025

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AP22950

Device Taping Orientation

Package Type: U-WLB2515-15

Tape Width Part Number Suffix

Tape Orientation

8mm

-7

Note:

For part marking, refer to Marking Information.

Note:

Tape and package drawings are not to scale and are shown for device tape orientation only.

Note:

The taping orientation of the other package type can be found on our website at https://www.diodes.com/assets/Packaging-Support-Docs/AP02007.pdf.

Mechanical Data

•

Surface-Mount Package

•

Moisture Sensitivity: Level 1 per J-STD-020

•

Terminals: Finish

– Tin Silver Copper (SnAgCu), Solderable per MIL-STD-202, Method 208

•

Weight: 0.00472 grams (Approximate)

•

Max Soldering Temperature +260°C for 30 secs as per JEDEC J-STD-020