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ADS1113 Datasheet(PDF) 2 Page - Texas Instruments

Part # ADS1113
Description  ADS1018 Ultrasmall, Low-Power, SPI™-Compatible, 12-Bit, Analog-to-Digital Converter With Internal Reference and Temperature Sensor
PDF  43 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

ADS1113 Datasheet(HTML) 2 Page - Texas Instruments

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ADS1018
SBAS526D – NOVEMBER 2012 – REVISED SEPTEMBER 2019
www.ti.com
Product Folder Links: ADS1018
Submit Documentation Feedback
Copyright © 2012–2019, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Device Comparison Table..................................... 4
6
Pin Configuration and Functions ......................... 4
7
Specifications......................................................... 5
7.1
Absolute Maximum Ratings ...................................... 5
7.2
ESD Ratings.............................................................. 5
7.3
Recommended Operating Conditions ....................... 5
7.4
Thermal Information .................................................. 5
7.5
Electrical Characteristics........................................... 6
7.6
Timing Requirements: Serial Interface...................... 8
7.7
Switching Characteristics: Serial Interface................ 8
7.8
Typical Characteristics .............................................. 9
8
Detailed Description ............................................ 10
8.1
Overview ................................................................. 10
8.2
Functional Block Diagram ....................................... 10
8.3
Feature Description................................................. 11
8.4
Device Functional Modes........................................ 15
8.5
Programming........................................................... 16
8.6
Register Maps ......................................................... 19
9
Application and Implementation ........................ 21
9.1
Application Information............................................ 21
9.2
Typical Application ................................................. 26
10
Power Supply Recommendations ..................... 29
10.1
Power-Supply Sequencing.................................... 29
10.2
Power-Supply Decoupling..................................... 29
11
Layout................................................................... 30
11.1
Layout Guidelines ................................................. 30
11.2
Layout Example .................................................... 31
12
Device and Documentation Support ................. 32
12.1
Documentation Support ........................................ 32
12.2
Receiving Notification of Documentation Updates 32
12.3
Community Resources.......................................... 32
12.4
Trademarks ........................................................... 32
12.5
Electrostatic Discharge Caution ............................ 32
12.6
Glossary ................................................................ 32
13
Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (November 2015) to Revision D
Page
•
Changed maximum VDD voltage from 5.5 V to 7 V in the Absolute Maximum Ratings table ............................................... 5
•
Changed bit description of Config Register bit 0 .................................................................................................................. 20
Changes from Revision B (October 2013) to Revision C
Page
•
Added ESD Ratings table, Feature Description section, Noise Performance section, Device Functional Modes
section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Changed title, Description section, Features section, and block diagram on front page ....................................................... 1
•
Changed title from Product Family to Device Comparison Table and deleted Package Designator column ........................ 4
•
Updated descriptions and changed name of I/O column in Pin Configurations and Functions table .................................... 4
•
Changed digital input voltage range and added minimum specification for TJ in Absolute Maximum Ratings table............. 5
•
Added Differential input impedance specification in Electrical Characteristics ...................................................................... 6
•
Changed Condition statement in Timing Requirements: Serial Interface ............................................................................. 8
•
Moved tCSDOD, tDOPD, and tCSDOZ parameters from Timing Requirements to Switching Characteristics ................................ 8
•
Moved tCSDOD and tCSDOZ values from MIN column to MAX column. ...................................................................................... 8
•
Deleted Figure 7, Noise Plot................................................................................................................................................... 9
•
Updated Overview section and deleted "Gain = 2/3, 1, 2, 4, 8, or 16" from Functional Block Diagram ............................. 10
•
Updated Analog Inputs section............................................................................................................................................. 12
•
Updated Full-Scale Range (FSR) and LSB Size section ..................................................................................................... 13
•
Updated Reset and Power Up section ................................................................................................................................. 15
•
Updated 32-Bit Data Transmission Cycle section ................................................................................................................ 18
•
Updated Register Maps section ........................................................................................................................................... 19
•
Updated Application Information section .............................................................................................................................. 21



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