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PACKAGE OUTLINE

C

14X 0.3

0.2

1.6

1.4

14X 0.55

0.35

1 MAX

2X

3

3.5

3.3

12X 0.5

0.05

0.00

A

4.1

3.9

B

3.1

2.9

0.3

0.2

0.55

0.35

(0.2) TYP

VSON - 1 mm max height

DMD0014A

PLASTIC SMALL OUTLINE - NO LEAD

4221688/A 09/2014

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

7

8

14

(OPTIONAL)

PIN 1 ID

0.1

C A

B

0.05

C

EXPOSED

THERMAL PAD

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

DETAIL

SEE TERMINAL

SCALE 3.500

DETAIL

OPTIONAL TERMINAL

TYPICAL