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INA821 Datasheet(PDF) 32 Page - Texas Instruments

Part # INA821
Description  INA819 35-μV Offset, 8-nV/√Hz Noise, Low-Power, Precision Instrumentation Amplifier
PDF  51 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

INA821 Datasheet(HTML) 32 Page - Texas Instruments

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10 Power Supply Recommendations
The nominal performance of the INA819 is specified with a supply voltage of ±15 V and midsupply reference
voltage. The device also operates using power supplies from ±2.25 V (4.5 V) to ±18 V (36 V) and non-midsupply
reference voltages with excellent performance. Parameters that can vary significantly with operating voltage and
reference voltage are shown in the Section 7.6 section.
11 Layout
11.1 Layout Guidelines
Attention to good layout practices is always recommended. For best operational performance of the device, use
good PCB layout practices, including:
• Take care to make sure that both input paths are well-matched for source impedance and capacitance
to avoid converting common-mode signals into differential signals. Even slight mismatch in parasitic
capacitance at the gain setting pins can degrade CMRR over frequency. For example, in applications
that implement gain switching using switches or PhotoMOS® relays to change the value of RG, select the
component so that the switch capacitance is as small as possible and most importantly so that capacitance
mismatch between the RG pins is minimized.
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole and of the device.
Bypass capacitors reduce the coupled noise by providing low-impedance power sources local to the analog
circuitry.
– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible.
If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better than in
parallel with the noisy trace.
• Place the external components as close to the device as possible. As shown in Figure 11-1, keep RG close to
the pins to minimize parasitic capacitance.
• Keep the traces as short as possible.
• Connect exposed thermal pad to negative supply –V.
INA819
SBOS959D – DECEMBER 2018 – REVISED APRIL 2022
www.ti.com
32
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Product Folder Links: INA819



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