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INA821 Datasheet(PDF) 48 Page - Texas Instruments |
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INA821 Datasheet(HTML) 48 Page - Texas Instruments |
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48 / 51 page ![]() www.ti.com PACKAGE OUTLINE C 8X 0.3 0.2 2.4 0.1 2X 1.5 1.45 0.1 6X 0.5 0.8 0.7 8X 0.6 0.4 0.05 0.00 A 3.1 2.9 B 3.1 2.9 (DIM A) TYP OPT 01 SHOWN WSON - 0.8 mm max height DRG0008B PLASTIC SMALL OUTLINE - NO LEAD 4218886/A 01/2020 DIMENSION A OPTION 01 (0.1) OPTION 02 (0.2) PIN 1 INDEX AREA SEATING PLANE 0.05 C 1 4 5 8 (OPTIONAL) PIN 1 ID 0.1 C A B 0.08 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 4.000 |
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