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ISO1050 Datasheet(PDF) 21 Page - Texas Instruments |
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ISO1050 Datasheet(HTML) 21 Page - Texas Instruments |
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21 / 42 page ![]() Normal CAN communication CAN Bus Signal TXD fault stuck dominant: example PCB failure or bad software Fault is repaired and local node transmission capability restored TXD %XV ZRXOG EH ³VWXFN GRPLQDQW´ EORFNLQJ communication for the whole network but TXD DTO prevents this and frees the bus for communication after the time tTXD_DTO. tTXD_DTO Communication from repaired local node Communication from other network nodes Figure 8-3. Example Timing Diagram for Devices With TXD DTO 8.3.3.2 Thermal Shutdown If the junction temperature of the device exceeds the thermal shut down threshold the device turns off the CAN driver circuits thus blocking the TXD to bus transmission path. The shutdown condition is cleared when the junction temperature drops below the thermal shutdown temperature of the device. If the fault condition is still present, the temperature may rise again and the device would enter thermal shut down again. Prolonged operation with thermal shutdown conditions may affect device reliability. Note During thermal shutdown the CAN bus drivers turn off; thus no transmission is possible from TXD to the bus. The CAN bus pins are biased to recessive level during a thermal shutdown, and the receiver to RXD path remains operational. 8.3.3.3 Undervoltage Lockout and Fail-Safe The supply pins have undervoltage detection that places the device in protected or fail-safe mode. This protects the bus during an undervoltage event on VCC1 or VCC2 supply pins. If the bus-side power supply VCC2 is lower than about 4 V, the power shutdown circuits in the ISO1050 will disable the transceiver to prevent false transmissions due to an unstable supply. If VCC1 is still active when this occurs, the receiver output (RXD) will go to a fail-safe HIGH (recessive) value in about 6 microseconds. Table 8-1. Undervoltage Lockout and Fail-Safe VCC1 VCC2 DEVICE STATE BUS OUTPUT RXD GOOD GOOD Functional Per Device State and TXD Mirrors Bus BAD GOOD Protected Recessive High Impedance (3-state) GOOD BAD Protected High Impedance Recessive (Fail-Safe High) space Note After an undervoltage condition is cleared and the supplies have returned to valid levels, the device typically resumes normal operation in 300 µs 8.3.3.4 Floating Pins Pullups and pulldowns should be used on critical pins to place the device into known states if the pins float. The TXD pin should be pulled up through a resistor to VCC1 to force a recessive input level if the microprocessor output to the pin floats. www.ti.com ISO1050 SLLS983L – JUNE 2009 – REVISED OCTOBER 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: ISO1050 |
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