6.4 Thermal Information

THERMAL METRIC(1)

ISO1050

UNIT

DW

DUB

16 PINS

8 PINS

RΘJA

Junction-to-ambient thermal resistance

76.4

84.3

°C/W

RΘJC(top)

Junction-to-case (top) thermal resistance

41

63.2

°C/W

RΘJB

Junction-to-board thermal resistance

47.7

43

°C/W

ΨJT

Junction-to-top characterization parameter

17.2

27.4

°C/W

ΨJB

Junction-to-board characterization parameter

38.2

42.7

°C/W

RΘJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

PD

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.25 V, TJ = 150°C, RL =

60 Ω

TXD with 5V, 500kHz 50% duty square

wave

200

mW

PD1

Maximum power dissipation (side-1)

VCC1 = VCC2 = 5.25 V, TJ = 150°C, RL =

60 Ω , TXD with 5V, 500kHz 50% duty

square wave

25

mW

PD2

Maximum power dissipation (side-2)

VCC1 = VCC2 = 5.25 V, TJ = 150°C, RL =

60 Ω

TXD with 5V, 500kHz 50% duty square

wave

175

mW

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ISO1050

SLLS983L – JUNE 2009 – REVISED OCTOBER 2023

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