MSP430 datasheet(18/96 Pages) TI2

18 / 96 page

MSP430G2533, MSP430G2433, MSP430G2333, MSP430G2233

MSP430G2403, MSP430G2303, MSP430G2203

SLAS734G – APRIL 2011 – REVISED APRIL 2016

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Product Folder Links: MSP430G2533 MSP430G2433 MSP430G2333 MSP430G2233 MSP430G2403 MSP430G2303

MSP430G2203

Specifications

(1)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC (R

θJC) value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment and application. For more information, see these EIA/JEDEC

standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

5.8

Thermal Resistance Characteristics

PARAMETER

VALUE (1)

UNIT

θJA

Junction-to-ambient thermal resistance, still air (2)

VQFN (RHB-32)

32.1

°C/W

TSSOP (PW-28)

72.2

TSSOP (PW-20)

86.5

PDIP (N-20)

49.3

θJC(TOP)

Junction-to-case (top) thermal resistance (3)

VQFN (RHB-32)

22.3

°C/W

TSSOP (PW-28)

18.3

TSSOP (PW-20)

20.8

PDIP (N-20)

θJC(BOTTOM) Junction-to-case (bottom) thermal resistance

VQFN (RHB-32)

1.4

°C/W

TSSOP (PW-28)

N/A

TSSOP (PW-20)

N/A

PDIP (N-20)

N/A

θJB

Junction-to-board thermal resistance (4)

VQFN (RHB-32)

6.1

°C/W

TSSOP (PW-28)

30.4

TSSOP (PW-20)

PDIP (N-20)

30.2

ΨJT

Junction-to-package-top characterization parameter

VQFN (RHB-32)

0.3

°C/W

TSSOP (PW-28)

0.7

TSSOP (PW-20)

0.8

PDIP (N-20)

18.1

ΨJB

Junction-to-board characterization parameter

VQFN (RHB-32)

6.1

°C/W

TSSOP (PW-28)

29.9

TSSOP (PW-20)

38.1

PDIP (N-20)

30.1

MSP430 Datasheet(PDF) 18 Page - Texas Instruments

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