MSP430 datasheet(27/96 Pages) TI2

27 / 96 page

MSP430G2533, MSP430G2433, MSP430G2333, MSP430G2233

MSP430G2403, MSP430G2303, MSP430G2203

www.ti.com

SLAS734G – APRIL 2011 – REVISED APRIL 2016

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Product Folder Links: MSP430G2533 MSP430G2433 MSP430G2333 MSP430G2233 MSP430G2403 MSP430G2303

MSP430G2203

Specifications

(1)

To improve EMI on the XT1 oscillator, the following guidelines should be observed.

•

Keep the trace between the device and the crystal as short as possible.

•

Design a good ground plane around the oscillator pins.

•

Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.

•

Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.

•

Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.

•

If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.

•

Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This

signal is no longer required for the serial programming adapter.

(2)

Includes parasitic bond and package capacitance (approximately 2 pF per pin).

Because the PCB adds additional capacitance, verify the correct load by measuring the ACLK frequency. For a correct setup, the

effective load capacitance should always match the specification of the used crystal.

(3)

Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.

Frequencies in between might set the flag.

(4)

Measured with logic-level input frequency but also applies to operation with crystals.

5.22 Crystal Oscillator, XT1, Low-Frequency Mode

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

fLFXT1,LF

LFXT1 oscillator crystal

frequency, LF mode 0, 1

XTS = 0, LFXT1Sx = 0 or 1

1.8 V to 3.6 V

32768

fLFXT1,LF,logic

LFXT1 oscillator logic level

square-wave input frequency,

LF mode

XTS = 0, XCAPx = 0, LFXT1Sx = 3

1.8 V to 3.6 V

10000

32768

50000

OALF

Oscillation allowance for

LF crystals

XTS = 0, LFXT1Sx = 0,

fLFXT1,LF = 32768 Hz, CL,eff = 6 pF

500

Ω

XTS = 0, LFXT1Sx = 0,

fLFXT1,LF = 32768 Hz, CL,eff = 12 pF

200

CL,eff

Integrated effective load

capacitance, LF mode(2)

XTS = 0, XCAPx = 0

XTS = 0, XCAPx = 1

5.5

XTS = 0, XCAPx = 2

8.5

XTS = 0, XCAPx = 3

Duty cycle, LF mode

XTS = 0, Measured at P2.0/ACLK,

fLFXT1,LF = 32768 Hz

2.2 V

30%

50%

70%

fFault,LF

Oscillator fault frequency,

LF mode(3)

XTS = 0, XCAPx = 0, LFXT1Sx = 3(4)

2.2 V

10000

5.23 Internal Very-Low-Power Low-Frequency Oscillator (VLO)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

VCC

MIN

TYP

MAX

UNIT

fVLO

VLO frequency

–40°C to 85°C

3 V

kHz

dfVLO/dT

VLO frequency temperature drift

–40°C to 85°C

3 V

0.5

%/°C

dfVLO/dVCC VLO frequency supply voltage drift

25°C

1.8 V to 3.6 V

%/V

5.24 Timer_A

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

fTA

Timer_A input clock frequency

SMCLK, duty cycle = 50% ±10%

fSYSTEM

MHz

tTA,cap

Timer_A capture timing

TA0, TA1

3 V

MSP430 Datasheet(PDF) 27 Page - Texas Instruments

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