8.3 Power Supply Recommendations

The OPA593 operates from power supplies up to ±42.5 V, or a total of 85 V, with excellent performance. Most

behavior remains unchanged throughout the full operating voltage range. A power-supply bypass capacitor of

at least 0.1 µF is required for proper operation. Make sure that the capacitor voltage is rated for high voltage

across the full operating temperature range. Parameters that vary significantly with operating voltage are shown

in Section 6.6.

Some applications do not require an equal positive and negative output voltage swing. Power-supply voltages

do not have to be equal. The OPA593 operates with as little as 8 V between the supplies, and with up to 85 V

between the supplies.

8.4 Layout

8.4.1 Layout Guidelines

During the surface-mount solder operation (when the pins are being soldered), the thermal pad must be soldered

to a copper area underneath the package. Through the use of thermal paths within this copper area, heat

is conducted away from the package into a V− plane. Always solder the thermal pad to the PCB, even with

applications that have low power dissipation. Follow these steps to attach the device to the PCB:

1. Connect the thermal pad to the most negative supply voltage on the device, V–.

2. Prepare the PCB with a top-side pattern. There must be patterning for the pins and thermal pad.

3. Thermal vias improve heat dissipation, but are not required.

4. Place recommended vias in the area of the thermal pad. Recommended thermal land size and thermal via

patterns for the SON-12 DNT package are shown in the thermal land pattern mechanical drawing appended

at the end of this document. Keep the vias small, so that solder wicking through the vias is not a problem

during reflow. Use a 0.2-mm size via with a minimum of five connected directly below the thermal pad.

5. Additional vias can be placed anywhere along the thermal plane outside of the thermal pad area. These vias

help dissipate the heat generated by the OPA593 device. These additional vias can be larger than the vias

directly under the thermal pad because the additional vias are not in the thermal pad area to be soldered;

thus, wicking is not a problem.

6. Connect all vias to the internal power plane of the correct voltage potential, V–.

7. When connecting these vias to the plane, do not use the typical web or spoke via connection methodology.

Web connections have a high thermal resistance connection that is useful for slowing the heat transfer

during soldering operations, making the soldering of vias that have plane connections easier. In this

application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the

vias under the OPA593 WSON package must make the connections to the internal plane with a complete

connection around the entire circumference of the plated-through hole.

8. The top-side solder mask must leave the pins of the package and the thermal pad area exposed. The

bottom-side solder mask must cover the vias of the thermal pad area. This masking prevents solder from

being pulled away from the thermal pad area during the reflow process.

9. Apply solder paste to the exposed thermal pad area and all of the device pins.

10. With these preparatory steps in place, simply place the device in position, and run through the solder reflow

operation as with any standard surface-mount component.

OPA593

SBOS659C – JANUARY 2022 – REVISED DECEMBER 2022

www.ti.com

28

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: OPA593